标题 |
An Integrated Cooling Effect Package for High Performance Computing Chips
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期刊:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 作者:Bo-Jiun Yang; Tai-Yu Chen; Tsung-Yu Pan; Bing-Yeh Lin; Yu-Jin Li; Wen-Sung Hsu 出版日期:2022 |
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