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46 积分 2022-10-21 加入
Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling
23小时前
待确认
Efficient Thermal Management Strategies for 3D-SiP Architectures
7个月前
已完结
Off-state mode TDDB reliability for ultra-thin gate oxides: New methodology and the impact of oxide thickness scaling
8个月前
已完结
Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method
1年前
已关闭
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