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zb123
Lv1
20 积分
2023-04-16 加入
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Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder
16天前
已完结
Mechanical properties of Sn–Pb based solder joints and fatigue life prediction of PBGA package structure
16天前
已完结
Effects of bismuth and nickel on the microstructure evolution of Sn-Ag-Cu (SAC)-based solders
26天前
已完结
Novel Sn-0.7Cu composite solder reinforced with ultrafine nanoscale nickel particles/porous carbon
27天前
已完结
Novel Sn-0.7Cu composite solder reinforced with ultrafine nanoscale nickel particles/porous carbon
30天前
已完结
Enhancement of Microstructural and Physical Properties of Sn-0.7Cu Lead-Free Solder with the Addition of SiC Particles
30天前
已完结
In Situ TEM Observations of Cu6Sn5 Polymorphic Transformations in Reaction Layers Between Sn-0.7Cu Solders and Cu Substrates
1个月前
已完结
Cu6Sn5 intermetallic: Reconciling composition and crystal structure
1个月前
已完结
Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances
1个月前
已完结
Insight into the improvement of service performance of Sn/Cu solder joint by Pt doping in Cu6Sn5 interfacial intermetallic compound
1个月前
已完结
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3个月前
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