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张金龙
Lv1
50 积分
2024-01-29 加入
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Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi
22天前
已完结
The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint
29天前
已完结
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review
30天前
已完结
Research on Bi contents addition into Sn–Cu-based lead-free solder alloy
30天前
已完结
Wetting behavior and interfacial reactions of Sn/Cu-xNi couples for high temperature application
1个月前
已完结
Enhancing Performance of Sn–Ag–Cu Alloy through Germanium Additions: Investigating Microstructure, Thermal Characteristics, and Mechanical Properties
1个月前
已完结
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
1个月前
已完结
Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7Cu solder: Experiments and first-principles calculations
3个月前
已完结
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22天前
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