Lv61
3190 积分 2024-03-29 加入
Reducing the peel strength of non-silicone organic release coatings by nanoparticle-induced roughness
1个月前
已完结
Flame-retardant epoxy thermosets derived from renewable resources: Research development and future perspectives
1个月前
已完结
Effects of Curing Agents on the Adhesion of Epoxy Resin to Copper: A Density Functional Theory Study
1个月前
已完结
Research progress of interfacial adhesion force of copper plating on Ajinomoto build-up films for chip substrates
1个月前
已完结
Pinhole formation and its mitigation for Cu electrodeposition on the Ajinomoto build-up film (ABF) with different surface roughnesses
2个月前
已完结
Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate
2个月前
已完结
High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)
2个月前
已完结
Pinhole formation and its mitigation for Cu electrodeposition on the Ajinomoto build-up film (ABF) with different surface roughnesses
2个月前
已完结
Characterization of ABF/Glass/ABF Substrates for mmWave Applications
2个月前
已完结
Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate
2个月前
已完结
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