Lv61
3080 积分 2024-03-29 加入
Pinhole formation and its mitigation for Cu electrodeposition on the Ajinomoto build-up film (ABF) with different surface roughnesses
1小时前
待确认
Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate
1小时前
待确认
High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)
7天前
已完结
Pinhole formation and its mitigation for Cu electrodeposition on the Ajinomoto build-up film (ABF) with different surface roughnesses
7天前
已完结
Characterization of ABF/Glass/ABF Substrates for mmWave Applications
7天前
已完结
Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate
7天前
已完结
Annealing temperature dependence of optical and structural properties of Cu films
7天前
已完结
FORMATION OF TRIANGULAR Cu MICROCRYSTALS IN Ti/Cu/Si THIN FILMS DURING ANNEALING
7天前
已完结
Influence of Cu Thickness and Annealing on the Properties of ZnS/Cu/ZnS Multilayer Films
7天前
已完结
Enhancing bonding strength between Cu and Cu2O through crystallographic orientation variation
23天前
已完结
皖公网安备34019202002308
