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164 积分 2023-04-06 加入
Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation
19天前
已完结
Synergistic enhancement of thermal conductivity in self-adhesive alumina-based thermal interface materials via hexagonal boron nitride size engineering
20天前
已完结
Scalable Graphene Fiber Arrays for Superior Thermal Interface Materials with High Reliability
1个月前
已完结
Liquid Metal‐Architected Thermal Management Materials: Void Engineering for Simultaneous High Thermal Conductivity and Flame Retardancy
3个月前
已完结
High Thermal Conductivity BiInSn Liquid Metal/Al Composite as High-Performance Thermal Interface Materials
4个月前
已完结
Extremely low thermal resistance in solid-state thermal pad from in situ graphite cracking for high-power artificial intelligence chip
4个月前
已完结
High Thermal Conductivity BiInSn Liquid Metal/Al Composite as High-Performance Thermal Interface Materials
4个月前
已完结
Design of Thermal Interface Materials with Excellent Interfacial Heat/Force Transfer Ability via Hierarchical Energy Dissipation
5个月前
已完结
Breaking the Thermal Conductivity–Adhesion–Viscosity Trade‐off in Thermally Conductive Adhesive via Hyperbranched Networks and Multi‐Scale Fillers
5个月前
已完结
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