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38 积分 2023-02-08 加入
Cohesive Zone Modeling of the Polyimide/Silicon Interface in 2.5D Packaging by Nanoindentation Testing
3个月前
已完结
Thermo-Mechanical Simulation Framework for Assessing Process-Induced Delamination Risks in Large-Area Fan-Out Panel-Level Packaging
5个月前
已完结
High-density high-speed linear I/O for AI clusters
7个月前
已完结
Near-packaged optics module with 32Gbps x 16 lanes for short reach interconnect
7个月前
已完结
An insight on optical metrology in manufacturing
8个月前
已完结
High Gas Void Fraction Two-Phase Flow Measurement Based on One-Dimensional Acoustic Wave in Pipeline
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