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AKA
Lv1
60 积分
2024-04-15 加入
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Silicon nitride and silicon etching by CH3F/02 and CH3F/CO2 plasma beams
12天前
已完结
Study of C4F8 gas for etch process in slow erase failure of flash memory devices
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THE STUDY OF STI ETCHING MICRO-LOADING IN REACTIVE ION ETCH (RIE)
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Towards Microstructures with Ultrahigh Aspect Ratio and Verticality in Deep Silicon Etching
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Time-Resolved Electron Energy Distributions and Plasma Characteristics in a Pulsed Capacitively Coupled Plasma
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Current-Source-Type Pulse Current Generator With Reduced Waveform Distortion for Capacitively Coupled Plasma Systems
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Advanced material for process performance in plasma process
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SI3N4 Plasma Etch Study for Optimized Morphology Performance
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ICP vs CCP in High Aspect Ratio Etching of SiO2 using Ar/C4F8/O2 Gas Mixtures
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Study of Plug Etch back process matching on faraday shielded ICP and traditional CCP plasma ETCH chambers
15天前
已完结
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