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30 积分 2023-05-05 加入
High-speed Cu electrodeposition and its solderability
3个月前
已完结
Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review
3个月前
已完结
Electrodeposition of 15 μm Nanotwinned Cu foils with Low Warpage and Excellent Mechanical Properties
3个月前
已完结
Facile dynamic current deposition of high tensile gradient Cu foil with (110) preferred orientation
3个月前
已完结
Correlations between two EBSD-based metrics Kernel Average Misorientation and Image Quality on indicating dislocations of near-failure low alloy steels induced by tensile and cyclic deformations
3个月前
已完结
Transmission Kikuchi diffraction in a scanning electron microscope: A review
4个月前
已完结
Transmission Kikuchi diffraction in a scanning electron microscope: A review
4个月前
已完结
Nanoscale crystallographic characterization of nanoporous catalyst by TKD
4个月前
已完结
Contacting ZnO Individual Crystal Facets by Direct Write Lithography
6个月前
已完结
A phase-field model of electrochemical migration for silver-based conductive adhesives
7个月前
已完结
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