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复杂小海豚
Lv1
30 积分
2023-06-20 加入
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To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
6天前
已完结
Thermo-Mechanical Challenges of 2.5D Packaging: A Review of Warpage and Interconnect Reliability
16天前
已完结
Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Ni/Sn-3.5Ag microsolder joints for 3D interconnection
2个月前
已完结
Synthesis and analysis of the structure of modified-Al2O3 particles used to increase the strength and electrical conductivity of lead-free solder based on Sn–Ag–Cu
2个月前
已完结
Synthesis and analysis of the structure of modified-Al2O3 particles used to increase the strength and electrical conductivity of lead-free solder based on Sn–Ag–Cu
2个月前
已完结
Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties
2个月前
已完结
Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
2个月前
已完结
Strategy against electromigration-induced stress by passivation thickness design
3个月前
已完结
恒温超塑性固相焊接工艺理论研究
4个月前
已完结
Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing
5个月前
已完结
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这篇文章与我所需要的文章题目不符,
8个月前
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