Lv11
40 积分 2021-06-27 加入
Mechanochemistry-mediated colloidal liquid metals for electronic device cooling at kilowatt levels
8小时前
待确认
A high heat transfer performance of inclined rib mini-channel heat sink designed by machine learning and laser powder bed fusion
2个月前
已完结
Surface-Metallized Diamond/Liquid Metal Composites Through Diamond Size Engineering as High-Performance Thermal Interface Materials
2个月前
已完结
A review on advanced carbon-based thermal interface materials for electronic devices
2个月前
已完结
Surface properties of monocrystalline silicon in diamond wire electrical discharge combined sawing
3个月前
已完结
High-Speed Machining of Ti–6Al–4V: RSM-GA based Optimization of Surface Roughness and MRR
3个月前
已完结
Liquid Crystals for Advanced Smart Devices with Microwave and Millimeter‐Wave Applications: Recent Progress for Next‐Generation Communications
3个月前
已完结
Fabrication of microchannel heat sink using additive manufacturing technology: A review
4个月前
已完结
Optimization of embedded cooling for hotspots based on compound plate thermal spreading model
4个月前
已完结
Simulation and experiment of WEDM double-scale array microstructure surface wetting performance
4个月前
已完结
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