Lv11
40 积分 2025-11-12 加入
Numerical and experimental study of an integrated thermoelectric active cooling system for ultra-high temperature downhole electronics
4小时前
已完结
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
4小时前
已完结
Research progress on refrigeration technologies of car refrigerator
6个月前
已完结
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