Lv31
208 积分 2022-11-27 加入
DynamoLLM: Designing LLM Inference Clusters for Performance and Energy Efficiency
4天前
已完结
Adsorption Heat Pump Cycles
5天前
已完结
Rapid AI-driven Power-Thermal Intelligent DVFS for HPC Applications
7天前
已完结
Thermal Conductivity is NOT the Only Deciding Factor: A Guide to Understanding Unaddressed Challenges with Liquid Metals TIMs
10天前
已完结
Engineering Synthetic Zeolites for Enhanced CO₂ Capture: Strategies, Synthesis, and Applications
10天前
已完结
Transient temperature distribution in a multilayer semiconductor device with dynamic thermal load and non-uniform thermal contact resistance between layers
10天前
已完结
Atomic force microscopy: from research lab to high-volume manufacturing
13天前
已完结
3D metrology and inspection to enable the rise of stacked transistors, wafers, and chips
13天前
已完结
AFM metrology for 3D high aspect ratio semiconductor structures
14天前
已完结
High-Density Wafer Level Connectivity Using Frontside Hybrid Bonding at 250nm Pitch and Backside Through-Dielectric Vias at 120nm Pitch After Extreme Wafer Thinning
14天前
已完结
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