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Effect of Post-Annealing Conditions on Interfacial Adhesion Energy of Cu-Cu Bonding for 3-D IC Integration
5天前
已关闭
Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
5个月前
已完结
10.1126
6个月前
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Spatiotemporal Binary Acoustic Metasurfaces
6个月前
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Low-intensity focused ultrasound for human neuromodulation
7个月前
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Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
9个月前
已完结
HTMapper: Bidirectional Head-Tail Mapping for Nested Named Entity Recognition
1年前
已完结
Bright and gap solitons in membrane-type acoustic metamaterials
1年前
已完结
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