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1030 积分 2026-04-17 加入
Material properties and grinding mechanism of SiC laser slicing wafers
8小时前
待确认
Comparative Ablation Behaviors of 2D Needled C/SiC and C/SiC-ZrC Composites
8小时前
已完结
Material Removal Mechanism and Evaluation of Machined Surface Quality of SiCf/SiC Composites by Laser Ablation-assisted Milling
8小时前
求助中
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