Lv2
132 积分 2025-01-13 加入
Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods
1个月前
已完结
Molded underfill (MUF) encapsulation for flip-chip package: A numerical investigation
2个月前
已完结
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
3个月前
已完结
Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates
3个月前
已完结
Microscale underfill dynamics and void formation of high-density flip-chip packaging: Experiments and simulations
5个月前
已完结
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN
5个月前
已完结
Developing ILU dispensing parameter model void size predictor on asymmetrical BGA flip-chip underfilling process
5个月前
已完结
Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
5个月前
已完结
Filling efficiency of flip-chip underfill encapsulation process
5个月前
已完结
Spatial analysis of underfill flow in flip-chip encapsulation
5个月前
已完结
皖公网安备34019202002308
