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116 积分 2025-01-13 加入
Microscale underfill dynamics and void formation of high-density flip-chip packaging: Experiments and simulations
1个月前
已完结
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN
2个月前
已完结
Developing ILU dispensing parameter model void size predictor on asymmetrical BGA flip-chip underfilling process
2个月前
已完结
Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
2个月前
已完结
Filling efficiency of flip-chip underfill encapsulation process
2个月前
已完结
Spatial analysis of underfill flow in flip-chip encapsulation
2个月前
已完结
Deep learning and analytical study of void regional formation in flip-chip underfilling process
2个月前
已完结
Underfill Flow in Flip-Chip Encapsulation Process: A Review
7个月前
已完结
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