Lv11
50 积分 2025-01-13 加入
Multiphase Modeling and Machine Learning Analysis of Void Formation in Chip-to-Wafer Underfill Encapsulation
10分钟前
待确认
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages
3天前
已完结
A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
12天前
已完结
Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package
12天前
已完结
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
14天前
已完结
Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods
3个月前
已完结
Molded underfill (MUF) encapsulation for flip-chip package: A numerical investigation
4个月前
已完结
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
4个月前
已完结
Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates
4个月前
已完结
Microscale underfill dynamics and void formation of high-density flip-chip packaging: Experiments and simulations
6个月前
已完结
皖公网安备34019202002308
