Lv11
50 积分 2024-03-27 加入
Computational multiscale modelling of material interfaces in electrical conductors
2小时前
已关闭
Cohesive zone modeling on fatigue fracture of Cu/Si interface in nanoscale multilayers
3小时前
已完结
Addressing interconnect challenges for enhanced computing performance
4小时前
已完结
Cu–Cu direct bonding in air by in-situ reduction of copper oxide with glycerol
1年前
已关闭
皖公网安备34019202002308
