Lv11
30 积分 2025-09-14 加入
Breaking Thermal Conductivity–Electrical Resistivity Trade‐Off in Liquid Metal–Based Thermal Interface Materials via Interface Engineering
3小时前
待确认
Surface-Modified InVGr as a Thermal Interface Material with High Thermal Conductivity and Low Contact Thermal Resistance
21天前
已完结
The development of thermal interface materials
4个月前
已完结
Metal powder atomization preparation, modification, and reuse for additive manufacturing: A review
7个月前
已完结
Engineering Poly(ionic liquid) Composites for Silicone-Free Thermal Interface Materials: Enhanced Thermal Conductivity and Interfacial Adhesion
7个月前
已完结
High thermal conductivity in diamond induced carbon fiber-liquid metal mixtures
7个月前
已完结
Liquid metal (LM) and its composites in thermal management
7个月前
已完结
Liquid Metal-Based Chip Cooling Technologies: A Review
7个月前
已完结
A review in thermal management for advanced chip packaging from chip to heat sink
8个月前
已完结
A Biomimetic Thermal Conduction Network Enables Metal-Level Thermal Conductivity in Polymer Nanocomposites
8个月前
已完结
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