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60 积分 2026-05-08 加入
Reliability evaluation and modeling of high density electronic packages
8小时前
已完结
Multiscale, Multiphysics Model of Underfill Flow for Flip-Chip Packages
9小时前
已完结
Guest editorial for the special issue on ‘computational multiphysics methods for integrated circuits and packaging’
9小时前
已完结
Optimization Design of Packaging Insulation for Half-Bridge SiC MOSFET Power Module Based on Multi-Physics Simulation
9小时前
已完结
Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review
9小时前
待确认
An efficient quasi-transient electro-thermal algorithm for system-in-package based on the unconditionally stable finite-difference method
9小时前
待确认
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