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40 积分 2021-10-29 加入
DSC and DMTA studies of a thermal interface material for packaging high speed microprocessors
1小时前
待确认
New developments for a no-pump-out high-performance thermal grease
21小时前
已完结
Performance comparison of thermal interface materials for power electronics applications
5天前
已完结
Deformable and Highly Adhesive Poly(ionic liquid)/Liquid Metal Visco-Elastomers for Thermal Management
5天前
已完结
Poly(ionic liquid)‐Based Thermal Interface Materials with Enhanced Interfacial Adhesion and Thermal Stability for Advanced Electronic Cooling
5天前
已完结
Rheology of Thermal Interface Materials Composed of Silicone Gels
9天前
已完结
Thermal contact resistance of cured gel polymeric thermal interface material
9天前
已完结
Thermal Interface Materials - A Review of the State of the Art
9天前
已完结
A Review of the Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications
9天前
已完结
Advances in Thermal Conductivity
11天前
已完结
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