Lv3
306 积分 2023-06-06 加入
Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations
26天前
已完结
Underfill Flow in Flip-Chip Encapsulation Process: A Review
26天前
已完结
Synthesis of divinyl compounds of type of bis-(p-vinylphenyl)alkanes
1个月前
已关闭
High‐yield synthesis and characterization of 1,2‐bis(p‐vinylphenyl)ethane
1个月前
已完结
Low-CTE, Strong-Adhesion, and High-Resolution Photosensitive Polyimide Materials for Advanced Packaging Applications: Structure and Properties
2个月前
已完结
Inhibition of acrylic acid and acrylate autoxidation
2个月前
已完结
Failure Relief in WLP and PLP Polymer Layers
2个月前
已完结
Molecular Pathways for Polymer Degradation during Conventional Processing, Additive Manufacturing, and Mechanical Recycling
2个月前
已完结
Relationship between Molecular Aggregation Structures and Optical Properties of Polyimide Films Analyzed by Synchrotron Wide-Angle X-ray Diffraction, Infrared Absorption, and UV/Visible Absorption Spectroscopy at Very High Pressure
3个月前
已完结
Synthesis and characterization of polyimides with rigid folded fragments
3个月前
已完结
皖公网安备34019202002308
