Lv41
626 积分 2023-06-06 加入
Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
29天前
已关闭
Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
29天前
已关闭
Influence of Macroscale Dimension on the Electrocrystallization of Cu Pad and Redistributed Layer in Advanced Packaging
1个月前
已完结
RDL Copper Plating Process for Panel Level Packaging Application
1个月前
已完结
Reliability Study of Critical Structural Redistribution Layers in Advanced Packaging: A Review
1个月前
已完结
Modified Free-Volume Theory for Solvent Diffusion Considering Hydrogen Bonds: Application to poly(amic acid) Solution
1个月前
已完结
Study on the Diffusion Coefficients of Molecules in Precursor Varnishes and Solid Polyimides for Understanding the Polyimide Curing Process
1个月前
已完结
(Invited) Temporary Bonding with Polydimethylglutarimide for Residue-Free Layer Transfer and 3-D Integration
1个月前
已完结
Polydimethylglutarimide (PMGI) as a sacrificial material for SU-8 surface-micromachining
2个月前
已完结
Reliability of SiC SBD Edge Terminations under HV-H3TRB and Thermal Cycling Tests
2个月前
已完结
皖公网安备34019202002308
