Lv11
90 积分 2026-02-13 加入
Advances in High-Aspect-Ratio Deep Reactive Ion Etching of 4H-Silicon Carbide Wafers
2天前
已完结
Artificial Intelligence-Driven Optimization for 3-D Integrated Circuit Manufacturing: A System of Systems Framework
1个月前
已完结
Enhanced Avalanche Capability and Ruggednessin 4H-SiC p-i-n Diode by Low-AnglePositive Beveled Edge Termination
4个月前
已完结
Trench Etch for SiC Power Devices
5个月前
已完结
新质生产力保障粮食安全：逻辑、困境及路径
5个月前
已采纳
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