Lv11
30 积分 2025-11-27 加入
Highly thermally conductive and soft thermal interface materials based on vertically oriented boron nitride film
3小时前
待确认
Mechanochemistry-mediated colloidal liquid metals for electronic device cooling at kilowatt levels
3小时前
已完结
Analysis of Coefficient of Thermal Expansion in Carbon Black Filled PDMS Composite
4个月前
已完结