Lv11
60 积分 2025-10-22 加入
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
10天前
已完结
Study On Behaviour Of Aluminium Metal Matrix Composite Reinforced With Silicon Carbide And Titanium Diboride
2个月前
已完结
Fabrication of silicon nitride with high thermal conductivity and flexural strength by hot‐pressing flowing sintering
4个月前
已完结
Effect of the ratio of Y2O3 and MgSiN2 sintering additives on the microstructure, thermal and mechanical properties of Si3N4 ceramics
4个月前
已完结
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