Lv21
198 积分 2025-08-18 加入
A highly bendable thin film encapsulation by the modulation of thermally induced interfacial residual stress
1个月前
已完结
Plasma-enhanced atomic layer deposition of silicon nitride for front-end-of-line applications
1个月前
已完结
Low-temperature atomic-layer-deposition lift-off method for microelectronic and nanoelectronic applications
1个月前
已完结
Characteristics of Silicon Oxide Thin Film Deposited via Remote Plasma Atomic Layer Deposition
1个月前
已完结
Plasma-assisted ALD for the conformal deposition of SiO₂: process, material and electronic properties
1个月前
已完结
Characteristics of Silicon Oxide Thin Film Deposited via Remote Plasma Atomic Layer Deposition
1个月前
已完结
Self-catalysis by aminosilanes and strong surface oxidation by O2 plasma in plasma-enhanced atomic layer deposition of high-quality SiO2
1个月前
已完结
Thermoelectric and electronic transport properties of thermal and plasma-enhanced ALD grown titanium nitride thin films
1个月前
已完结
Atomic Layer Deposition of WO3 Thin Films using W(CO)6 and O3 Precursors
2个月前
已完结
Stress Management in Thin-Film Gas-Permeation Barriers
2个月前
已完结
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