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62 积分 2023-02-01 加入
A Novel Fracture Mechanics Technique on Studying Passivation Crack Behavior for Advanced Si Package with Aluminum Redistribution Layer (AL-RDL) Routing
1个月前
已完结
Study of Small Polyimide Open Size in Contact Resistance and Reliability For Flip Chip Cu Pillar Package
1个月前
已完结
2 D analysis of self aligned LDMOS structures in terms of breakdown voltages
3个月前
已完结
10-kV SiC MOSFET Power Module With Reduced Common-Mode Noise and Electric Field
3个月前
已完结
A new nonlinear fatigue cumulative damage model based on load interaction and strength degradation
4个月前
已完结
Multiphysics Reliability Modeling of Flip-Chip Package Build Up Film Passivation Crack
4个月前
已完结
A Mechanistic Model for Plastic Metal Line Ratcheting Induced BEOL Cracks in Molded Packages
4个月前
已完结
A Novel Fracture Mechanics Technique on Studying Passivation Crack Behavior for Advanced Si Package with Aluminum Redistribution Layer (AL-RDL) Routing
4个月前
已完结
Detailed and analytical approach in the discovery of cracks on thin passivation layer underneath the polyimide structure of a die
4个月前
已完结
Study of Nitride Crack Reduction For Electronic Power Devices
4个月前
已完结
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