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50 积分 2023-02-01 加入
Analysis of Degradation Effects for Different Epoxy-Based Molding Compounds (EMC) Under High Temperature Aging
15天前
已完结
Moisture Transport under Power Cycling in Silicone-Gel Encapsulated Power Modules
15天前
已完结
Research on deep trench capacitor structure design and its effect on capacitance density and breakdown voltage
2个月前
已完结
A Novel Fracture Mechanics Technique on Studying Passivation Crack Behavior for Advanced Si Package with Aluminum Redistribution Layer (AL-RDL) Routing
4个月前
已完结
Study of Small Polyimide Open Size in Contact Resistance and Reliability For Flip Chip Cu Pillar Package
4个月前
已完结
2 D analysis of self aligned LDMOS structures in terms of breakdown voltages
6个月前
已完结
10-kV SiC MOSFET Power Module With Reduced Common-Mode Noise and Electric Field
6个月前
已完结
A new nonlinear fatigue cumulative damage model based on load interaction and strength degradation
7个月前
已完结
Multiphysics Reliability Modeling of Flip-Chip Package Build Up Film Passivation Crack
7个月前
已完结
A Mechanistic Model for Plastic Metal Line Ratcheting Induced BEOL Cracks in Molded Packages
7个月前
已完结
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