Lv0
0 积分 2025-05-07 加入
Revealing Wire Deflection in Silicon Wafer Slicing to Minimize Diamond Wire Waste
1天前
已完结
A comprehensive review on wafering of silicon substrate for photovoltaic solar cell
1天前
已完结
Progress and critical challenges in slicing of thin semiconductor wafers using ultra-fine diamond wire
1天前
已完结
Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing
1天前
已完结
A novel analytical model for predicting the thin-walled workpiece deformation considering the effect of residual stress accumulation and redistribution in layer by layer milling
1个月前
已完结
Reduction of distortions in large aluminium parts by controlling machining-induced residual stresses
2个月前
已完结
Ultrasonic Non-Destructive Detection Method for Residual Stress in Rotary Forging Aluminum Alloy Plates
2个月前
已完结
Dynamic simulation whole process optimization and experimental verification of milling aviation aluminum alloy aircraft structure
6个月前
已完结
Modeling and optimization of surface residual stress profiles in milling of aluminum 7075-T6 alloy
6个月前
已完结
Construction of a predictive model for residual stresses in micro-milling of 7075 aluminum alloy
6个月前
已完结
皖公网安备34019202002308
