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50 积分 2024-05-21 加入
Effect of low temperature annealing on microstructure and properties of copper foil
2个月前
已完结
Selective determination of PEG-PPG concentration in Cu plating bath with cyclic voltammetry stripping using iodide ion
4个月前
已完结
Electrodeposition of Nano-Twinned Cu and their Applications in Electronics
8个月前
已完结
反应控制下超声对铜电化学沉积过程的影响研究
9个月前
已完结
Advanced design of electrodeposited copper foil: Modulating grain growth and microstructure to achieve ultrahigh mechanical properties
9个月前
已完结
Dependence of microstructure and mechanical properties of electrodeposited copper foils on electrochemical behavior of sodium saccharin
9个月前
已完结
Single-crystallization of electrolytic copper foils
9个月前
已完结
Preparation of Ultra-thin Copper Foil with Low Profile and High Tensile Strength on Surface of 18-µm Carrier Copper Foil
9个月前
已完结
Surface morphology and underlying mechanisms of HVLP copper foils with different additives
10个月前
已完结
Preparation of ultra-thin copper–aluminum composite foils for high-energy–density lithium-ion batteries through synergistic electroless plating and electroplating
11个月前
已完结
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