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194 积分 2025-08-14 加入
Reliability of SiC MOSFET Power Modules under Consecutive H3TRB and Power Cycling Stress
1个月前
已关闭
Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module
1个月前
已完结
Simulation analysis of clip bonding package
1个月前
已完结
Low Modulus Polyimide Coating on Wedge Bond to Improve Wire Bond Robustness in Thermal Cycling
3个月前
已完结
A High-Density 3.3 kV/2000 A SiC MOSFET Power Module: Design, Fabrication, and Experimental Evaluation
7个月前
已完结
An Automatic Optimization Method for Electrical and Thermal Performance of Stacked DBC Power Module
8个月前
已完结
Enhanced di/dt-RC Sensing Structure for Accurate Dynamic Current Measurement in Paralleled SiC MOSFETs
9个月前
已完结
A Current Balancing Gate Driver for Dynamic Current Sharing of Paralleled SiC MOSFETs with Kelvin-Source Connection
9个月前
已完结
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