Lv22
110 积分 2025-08-14 加入
An Automatic Optimization Method for Electrical and Thermal Performance of Stacked DBC Power Module
1天前
已完结
Enhanced di/dt-RC Sensing Structure for Accurate Dynamic Current Measurement in Paralleled SiC MOSFETs
20天前
已完结
A Current Balancing Gate Driver for Dynamic Current Sharing of Paralleled SiC MOSFETs with Kelvin-Source Connection
20天前
已完结
功率器件封装用纳米金属焊膏制备与烧结机制研究
1个月前
已完结
On-time Dependency on the Power Cycling Capability of Al Bond Wires Measured by Shear Test
1个月前
已完结
Investigation of failure mechanism of aluminum-scandium wire bond contact under active power cycle test
1个月前
已完结
Simulation Based Design of Experiments of Power Cycling Tests using Die Top System Interconnect Technology Die Topy System (DTS(r))
2个月前
已完结
Reliability Assessment of Latest SiC Chip and Packaging Technology
2个月前
已完结
State-of-the-art of the bond wire failure mechanism and power cycling lifetime in power electronics
2个月前
已完结
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