Lv11
70 积分 2025-08-14 加入
Simulation Based Design of Experiments of Power Cycling Tests using Die Top System Interconnect Technology Die Topy System (DTS(r))
10天前
已完结
Reliability Assessment of Latest SiC Chip and Packaging Technology
10天前
已完结
State-of-the-art of the bond wire failure mechanism and power cycling lifetime in power electronics
11天前
已完结
Degradation Mechanisms of SiC MOSFET Power Module with Cu-Cu Die Top Interconnects under Power Cycling Stress
11天前
已完结
NiPdAu top Metal for Clip and Cu/Au Wire Bonding in a Hybrid Package
11天前
已完结
State-of-the-art of the bond wire failure mechanism and power cycling lifetime in power electronics
11天前
已完结
The sensitivity analysis of geometric parameters on the power cycling reliability of bond wires
11天前
已完结
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