Lv21
166 积分 2025-08-14 加入
Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module
2小时前
已完结
Simulation analysis of clip bonding package
4小时前
求助中
Low Modulus Polyimide Coating on Wedge Bond to Improve Wire Bond Robustness in Thermal Cycling
2个月前
已完结
A High-Density 3.3 kV/2000 A SiC MOSFET Power Module: Design, Fabrication, and Experimental Evaluation
5个月前
已完结
An Automatic Optimization Method for Electrical and Thermal Performance of Stacked DBC Power Module
7个月前
已完结
Enhanced di/dt-RC Sensing Structure for Accurate Dynamic Current Measurement in Paralleled SiC MOSFETs
7个月前
已完结
A Current Balancing Gate Driver for Dynamic Current Sharing of Paralleled SiC MOSFETs with Kelvin-Source Connection
7个月前
已完结
功率器件封装用纳米金属焊膏制备与烧结机制研究
8个月前
已完结
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