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聪慧寄文
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500 积分
2023-07-10 加入
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Effects of alloying elements on the interfacial segregation of bismuth in tin-based solders
13天前
已完结
Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling
13天前
已完结
Effect of Cu on the diffusion behavior of Bi in Sn matrix during electromigration
13天前
已完结
State of the Art of Lead-Free Solder Joint Reliability
1个月前
已完结
Effect of the addition of CeO2 nanoparticles on the microstructure and shear properties of Sn–57Bi–1Ag solder alloy
1个月前
已完结
A New Current Crowding Phenomenon for Flip-Chip-on-Leadframe (FCOL) Package and its Impact on Electromigration Reliability
1个月前
已完结
Experimental Study on the Melting Temperature, Microstructural and Improved Mechanical Properties of Sn58Bi/Cu Solder Alloy Reinforced with 1%, 2% and 3% Zirconia (ZrO2) Nanoparticles
1个月前
已完结
Impact of Non-Reactive Ceria Nanoparticles on the Wettability and Reaction Kinetics Between Lead-Free Sn–58Bi and Cu Pad
1个月前
已完结
Effect of the addition of CeO2 nanoparticles on the microstructure and shear properties of Sn–57Bi–1Ag solder alloy
1个月前
已完结
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review
3个月前
已完结
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