Lv12
24 积分 2024-09-13 加入
Low-CTE, Strong-Adhesion, and High-Resolution Photosensitive Polyimide Materials for Advanced Packaging Applications: Structure and Properties
22小时前
已完结
Synthesis and characterization of amide-bridged colorless polyimide films with low CTE and high optical performance for flexible OLED displays
22小时前
已完结
Preparation of highly thermally conductive, flexible and transparent AlOOH/polyimide composite film with high mechanical strength and low coefficient of thermal expansion
22小时前
已完结
Polydopamine-Modified Boron Nitride Nanosheet/Polyimide Composites with Enhanced Thermal Conductivity and Electrical Insulation for High-Frequency Applications
22小时前
已完结
Transparent polyimide films with ultra-low coefficient of thermal expansion
22小时前
已完结
Intrinsic low-dielectric Cardo polyimide with high heat resistance, high transparency, and low birefringence
10天前
已完结
Synthesis and Characterization of High Glass Transition Temperature Colorless Polyimides Containing Hydrogen Bonding Carbazole Diamine for Optoelectronic Devices
10天前
已完结
Extremely Low Humidity and Frequency Dependence of Dielectric Properties of Highly Fluorinated Polyimides in the 10–330 GHz Range
10天前
已完结
Ultralow Coefficient of Thermal Expansion and a High Colorless Transparent Polyimide Film Realized Through a Reinforced Hydrogen-Bond Network by In Situ Polymerization of Aromatic Polyamide in Colorless Polyimide
10天前
已完结
Short-side-chain regulation of colorless and transparent polyamide-imides for flexible transparent displays
17天前
已完结