Lv41
500 积分 2025-09-27 加入
Failure Mechanisms and Predictive Modeling of Micro Solder Joints Under Thermal Cycling
1天前
已完结
Multiwavelength Laser-Based Transient Thermoreflectance for Channel-Temperature Monitoring of GaN HEMTs
8个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
9个月前
已完结
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