Lv11
10 积分 2024-04-10 加入
Functions of 2-butyne-1,4-diol in the process of tin-silver alloy electrodeposition from the acidic sulfate solution
56分钟前
待确认
Nucleation of Tin and Tin–Silver Alloy on Copper and Nickel in Acid Plating Baths
1小时前
已完结
Novel Method for Detection of Organic Additives in Copper Plating Baths
1个月前
已关闭
The Practical Method for Monitoring Additives in Copper Electroplating Baths Using the Chronopotentiometry Technique
1个月前
已完结
Electrochemical spectroscopic analysis of additives in copper plating baths by DRT and multivariate approach
2个月前
已完结
Superconformal Electrodeposition of Co and Co–Fe Alloys Using 2-Mercapto-5-benzimidazolesulfonic Acid
8个月前
已完结
Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions
8个月前
已完结
The effect of quaternary ammonium salts with different chain lengths on copper filling behavior in blind holes of printed circuit board
8个月前
已完结
The effect of quaternary ammonium salts with different chain lengths on copper filling behavior in blind holes of printed circuit board
8个月前
已完结
Thermal Atomic Layer Etching of Copper by Sequential Steps Involving Oxidation and Exposure to Hexafluoroacetylacetone
10个月前
已完结
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