Lv21
190 积分 2024-01-23 加入
Modeling of interfacial void closure and prediction of bonding time in solid-state diffusion bonding
3小时前
待确认
Influence of humidity on reliability of plastic packages
29天前
已完结
The Effect of Thermal and Moisture Stress on Insulation Deterioration Law of Ionic Contaminated High-Voltage Printed Circuit Board of Electronic Power Conditioner
30天前
已完结
Saturated Pressure Measurements of trans-1-Chloro-3,3,3-trifluoroprop-1-ene (R1233zd(E))
3个月前
已完结
Phonon thermal transport and its tunability in GaN for near-junction thermal management of electronics: A review
5个月前
已完结
Performance analysis and optimization of an annular thermoelectric generator integrated with vapor chambers
5个月前
已关闭
Temperature Measurement Methods in Microwave Heating Technologies
11个月前
已完结
Micro pin fins with topologically optimized configurations enhance flow boiling heat transfer in manifold microchannel heat sinks
1年前
已完结
A fundamental characteristic and image analysis of liquid flow in an AW type EHD pump
1年前
已完结
Understanding of electrohydrodynamic conduction pumping phenomenon
1年前
已完结
皖公网安备34019202002308
