Lv3
208 积分 2024-01-23 加入
Large scale three-dimensional topology optimisation of heat sinks cooled by natural convection
1个月前
已完结
Reduced-order initialization model for accelerating topology optimization in thermal-fluid system
1个月前
已完结
Ai-driven bioinspired cooling plate design for enhanced lithium-ion battery thermal management: integrating topology optimization and deep learning
1个月前
已完结
Observation of interfacial void formation in bonded copper layers
10个月前
已完结
Capillary Filling of Nanoscale Channels and Surface Structure
10个月前
已完结
Observation of interfacial void formation in bonded copper layers
10个月前
已完结
Physical mechanisms of copper-copper wafer bonding
11个月前
已完结
Modeling of interfacial void closure and prediction of bonding time in solid-state diffusion bonding
11个月前
已完结
Influence of humidity on reliability of plastic packages
1年前
已完结
The Effect of Thermal and Moisture Stress on Insulation Deterioration Law of Ionic Contaminated High-Voltage Printed Circuit Board of Electronic Power Conditioner
1年前
已完结
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