Lv22
120 积分 2025-07-10 加入
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication
40分钟前
已完结
Molecular Dynamics Simulations of Single-Crystalline TSV-Cu Deformation Under Thermal Loads
42分钟前
求助中
Wafer-to-wafer hybrid bonding at 400-nm interconnect pitch
46分钟前
已完结
Fine Pitch Wafer-to-Wafer Hybrid Bonding for Three-Dimensional Integration
47分钟前
已完结
Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking
2小时前
已完结
Contamination-Free Cu/SiCN Hybrid Bonding Process Development for Sub- μm Pitch Devices with Enhanced Bonding Characteristics
2小时前
已完结
A study on the mechanical properties of polycrystalline aluminum nitride based on molecular dynamics simulation
1天前
已完结
Glycerol Vapor Assisted Cu Direct Bonding: Implications for 3D Semiconductor Packaging
1天前
已完结
Atomistic insights into the gradient polycrystalline effects on interfacial behavior in Cu-Cu direct bonding using molecular dynamics simulation
1天前
已完结
Molecular dynamics simulation of the direct bonding of (111)-oriented nanotwinned Cu and its related mechanical behavior
1天前
已完结
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