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50 积分 2025-11-11 加入
Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips
5个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
5个月前
已完结
Chips cool off with integrated microfluidics
5个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
5个月前
已完结
Chips cool off with integrated microfluidics
5个月前
已完结
Multi-Physics Coupling in IGBT Modules: A Review
6个月前
已完结