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86 积分 2024-11-18 加入
FEA study on the TSV copper filling influenced by the additives and electroplating process
29天前
已完结
Novel suppressor for damascene copper electrodeposition: Thioether-modified polyether with enhanced adsorption through an adjustable synthesis strategy
2个月前
已完结
Controlling Four Agent Formations
4个月前
已完结
Non-invasive brain stimulation: current and future applications in neurology
6个月前
已完结
Cathodic Debond of Anodically Bonded Silicon to Glass Wafers
7个月前
已完结
Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications
8个月前
已完结
The influence of leveler Brilliant Green on copper superconformal electroplating based on electrochemical and theoretical study
8个月前
已完结
Evaluating the via filling performance with thin surface Cu by the synergistic effect of different additives
8个月前
已完结
Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating
8个月前
已完结
Synthesis and Evaluation of Novel Nitrogen-Containing Aromatic Heterocyclic Compounds as Levelers for Copper Electroplating
9个月前
已完结
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