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70 积分 2024-11-18 加入
Cathodic Debond of Anodically Bonded Silicon to Glass Wafers
27天前
已完结
Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications
2个月前
已完结
The influence of leveler Brilliant Green on copper superconformal electroplating based on electrochemical and theoretical study
2个月前
已完结
Evaluating the via filling performance with thin surface Cu by the synergistic effect of different additives
2个月前
已完结
Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating
2个月前
已完结
Synthesis and Evaluation of Novel Nitrogen-Containing Aromatic Heterocyclic Compounds as Levelers for Copper Electroplating
2个月前
已完结
Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating
3个月前
已完结
The effect of quaternary ammonium salts with different chain lengths on copper filling behavior in blind holes of printed circuit board
3个月前
已完结
Critical Accelerator Concentration for Understanding Superfilling of Copper Electrodeposition
4个月前
已完结
Fabrication of high-aspect-ratio fused silica microstructures with large depths using Bessel-beam femtosecond laser-assisted etching
5个月前
已完结
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