Lv5
930 积分 2025-12-30 加入
Recent advances for thermal management of electronic devices: A state-of-the-art review
2个月前
已完结
Advanced Cold Plate Liquid Cooling Solution for Hyper-scale Data Center Application
3个月前
已完结
Microchannel heat sinks for cold plate liquid cooling in data centers: Advances, evaluations and prospects
3个月前
已完结
A Comprehensive Review on Geometric Variations in Fin Configurations: Experimental and Mathematical Studies
3个月前
已完结
Diamond/Cu composites microchannel heat sink for effective thermal management of SiC power devices
4个月前
已完结
Experimental study of heat dissipation for high-power multi-chips using enhanced microchannel flow boiling
4个月前
已完结
Thermal management of data centers: Chip-scale cooling using novel distributed inlet–outlet jet impingement liquid cold plate
4个月前
已完结
The development of thermal interface materials
4个月前
已完结
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