Lv1
30 积分 2026-05-09 加入
Exploring joining techniques for diamond chips on metallized substrates: Micro- and nano-scale mechanical testing approach
1天前
求助中
High Thermal Conductivity Diamond–Copper Composites Prepared via Hot Pressing with Tungsten–Coated Interfacial Layer Optimization
1天前
已完结
Ultrasonic vibration enabled cold manufacturing of high thermal conductive Cu/Diamond composites
1天前
已完结
皖公网安备34019202002308
