Lv2
128 积分 2026-05-09 加入
Study of the effect of Si/Dia interface structure on heat dissipation
1个月前
已完结
High-throughput fabrication and screening of interface-engineered diamond/Cu composites: effects of coating chemistry, thickness, and heat treatment on thermal transport and stability
2个月前
已完结
High-throughput fabrication and screening of interface-engineered diamond/Cu composites: effects of coating chemistry, thickness, and heat treatment on thermal transport and stability
2个月前
已完结
Adhesion at diamond/metal interfaces: A density functional theory study
2个月前
已完结
An investigation on the vacuum brazed diamond film and copper using low-temperature Ag-Cu-Sn-Ti filler alloys: Interfacial microstructure and mechanical performance
2个月前
已完结
Formation mechanism and microstructure evolution of Cu/Ti diffusion bonding interface and its influence on joint properties
2个月前
已完结
Uniform Growth of Two-inch MPCVD Optical Grade Diamond Film
2个月前
已完结
Scalable production of ultraflat and ultraflexible diamond membrane
2个月前
已完结
Direct Bonding of Diamond and Dissimilar Materials for Fabricating High Performace Power Devices
3个月前
已完结
Fabrication of Shape‐Controlled Copper Line Arrays by Meniscus‐Confined 3D Microprinting on Insulating Substrates
3个月前
已完结
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