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724 积分 2024-04-03 加入
Enhancing data center cooling efficiency and ability: A comprehensive review of direct liquid cooling technologies
3天前
已完结
A new ultra-thin vapor chamber with composite wick for thin electronic products
8天前
已完结
Experimental and analytical investigation of a 0.3-mm-thick loop heat pipe for 10 W-class heat dissipation
8天前
已完结
Stress analysis and thermal performance of ultra-thin heat pipes for compact electronics
8天前
已关闭
A novel ultra-thin vapor chamber with radial-gradient hierarchical wick for high-power electronics cooling
8天前
已关闭
High performance ultra-thin vapor chamber by reducing liquid film and enhancing capillary wicking
8天前
已完结
A novel ultra-thin vapor chamber with composite wick for portable electronics cooling
8天前
已完结
Vapor-liquid coplanar structure enables high thermal conductive and extremely ultrathin vapor chamber
8天前
已完结
Superspreading Surface with Hierarchical Porous Structure for Highly Efficient Vapor–Liquid Phase Change Heat Dissipation
8天前
已完结
Influence of vapor core design on thermal and hydraulic performance of mesh-type ultra-thin vapor chamber
8天前
已完结
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