Lv1
36 积分 2025-09-26 加入
CeyeHao: AI-driven microfluidic flow programming with hierarchically assembled obstacles and receptive field–augmented neural network
4天前
已完结
Design and Performance Study of Double-Layer Cross-Flow Microchannel Liquid-Cooled Plate
16天前
已完结
A note on reliability prediction of electronic equipment (MIL-HDBK-217B)
16天前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
17天前
已完结
Design and performance optimization of novel microchannel heat sinks for high-power electronic chips: A comparative study on geometric configurations and thermal management efficiency
17天前
已完结
Dependence of Tunneling Mechanism on Two-Dimensional Material Parameters: A High-Throughput Study
24天前
已完结
金属微通道热沉换热特性仿真与实验研究
26天前
已完结
Flow thermohydraulic characterization of hierarchical-manifold microchannel heat sink with uniform flow distribution
26天前
已完结
Numerical investigation of microchannel heat sinks with different inlets and outlets based on topology optimization
1个月前
已完结
皖公网安备34019202002308
