Lv11
88 积分 2025-09-26 加入
Heat dissipation analysis on the designed inner-outer circulation impingement double-layer microchannel heat sinks with chamfers in power electronic cooling system
1个月前
已完结
Synergistic design of bi-level heat sink combining topology-optimized microchannels with jet impingement for high-heat-flux applications
1个月前
已完结
Study of microchannel heat transfer characteristics based on topology optimization
1个月前
已完结
Highly efficient bio-inspired manifold microchannel cooling for steady-state and transient thermal management of high-power chips
1个月前
已完结
Highly efficient bio-inspired manifold microchannel cooling for steady-state and transient thermal management of high-power chips
1个月前
已完结
Simulation and optimization of thermo-hydraulic performance of radial manifold microchannel heat sink
1个月前
已完结
Biomimetic microchannel structures and their topological optimization: A review
1个月前
已完结
In‐Chip Mechanical Reliability Characterization and Modeling of CMOS‐Based Memristor for 3D Integration
1个月前
已完结
Embedded two-phase cooling of high heat flux electronics on silicon carbide (SiC) using thin-film evaporation and an enhanced delivery system (FEEDS) manifold-microchannel cooler
2个月前
已完结
Investigation of the cooling enhancement of a single crystal diamond heat sink with embedded microfluidic channels
2个月前
已完结
皖公网安备34019202002308
