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40 积分 2022-01-11 加入
Contamination-Controlled Pre-Assembly for High-Density Die-to-Wafer Hybrid Bonding
30天前
已完结
100-nm-level Post-Bond Accuracy and High-Yield Die-to-Wafer Hybrid Bonding System Using Non-Contact Die Transfer
30天前
已完结
Comprehensive Characterization of Surface Activation for Chip-to-Wafer Hybrid Bonding in 3D Flash Memory
30天前
已完结
A Spin-on Dielectric Material for High Aspect Ratio Gap Fill
3个月前
已完结
Cu–Cu low-temperature diffusion bonding by spark plasma sintering: Void closure mechanism and mechanical properties
5个月前
已完结
Effect of mesa geometry on the performance of green Micro-LEDs
5个月前
已关闭
Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
5个月前
已完结
Active‐Matrix GaN µ‐LED Display Using Oxide Thin‐Film Transistor Backplane and Flip Chip LED Bonding
6个月前
已完结
The improvement of bonding metal layers for high resolution micro-LED display application
6个月前
已完结
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