Lv1
40 积分 2022-01-11 加入
Cu–Cu low-temperature diffusion bonding by spark plasma sintering: Void closure mechanism and mechanical properties
2个月前
已完结
Effect of mesa geometry on the performance of green Micro-LEDs
2个月前
已关闭
Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
2个月前
已完结
Active‐Matrix GaN µ‐LED Display Using Oxide Thin‐Film Transistor Backplane and Flip Chip LED Bonding
2个月前
已完结
The improvement of bonding metal layers for high resolution micro-LED display application
2个月前
已完结
皖公网安备34019202002308
