Lv2
150 积分 2024-05-31 加入
Study of CF4, C2F6, SF6 and NF3 Decomposition Characteristics and Etching Performance in Plasma State
1个月前
已完结
Anisotropic Reactive Ion Etching of Aluminum Using Cl2, BCl3, and CH 4 Gases
2个月前
已完结
Tailored ion energy distributions on plasma electrodes
7个月前
已完结
Real-time, noninvasive monitoring of ion energy and ion current at a wafer surface during plasma etching
7个月前
已完结
Plasma etching of polydimethylsiloxane: Effects from process gas composition and dc self-bias voltage
7个月前
已完结
Trilevel reactive ion etching processes for fabrication of 60 nm germanium structures with high aspect ratio
7个月前
已完结
Effect of the RF bias on the plasma density in an argon inductively coupled plasma
7个月前
已完结
Physical Modeling and Characteristics of a Johnsen-Rahbek Type Electrostatic Chuck
7个月前
已完结
Atomic layer etching of SiO2 for surface cleaning using ammonium fluorosilicate with CF4/NH3 plasma
8个月前
已完结
Thin layer etching of silicon nitride: A comprehensive study of selective removal using NH3/NF3 remote plasma
8个月前
已完结
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