Lv3
370 积分 2022-10-15 加入
Through-Hole Filling by Copper Electroplating Using Sodium Thiazolinyl-Dithiopropane Sulfonate as the Single Additive
28天前
已完结
Preparation of Nano twin copper foil with high elongation and excellent suppression self-annealing via pulse superposition direct current method
1个月前
已完结
Correlation study of self-annealing-induced recrystallization and grain growth mechanism in copper foil
4个月前
已完结
Research on the twinning growth mechanism induced by self-annealing of electrolytic copper foil with special phase structure
4个月前
已完结
Achieving high-strength and high-ductility electrolytic copper foils through grain structure control
6个月前
已完结
Advanced Design of Electrodeposited Copper Foil: Modulating Grain Growth and Microstructure to Achieve Ultrahigh Mechanical Properties
9个月前
已完结
Relationship between the Orientation of the (100) Crystal Plane and Elongation in Ultrathin Electrolytic Copper Foils
9个月前
已完结
Effects of DPS on Surface Roughness and Mechanical Properties of Electrodeposited Copper Foils
9个月前
已完结
Preparation of Nano twin copper foil with high elongation and excellent suppression self-annealing via pulse superposition direct current method
9个月前
已完结
Effect of low temperature annealing on microstructure and properties of copper foil
9个月前
已完结
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