Lv5
1410 积分 2022-11-16 加入
Phonon‐Bridge Engineering in Vertically Aligned Graphene Paper Composites Enables Efficient and Reliable Thermal Interface Materials
4天前
已完结
Suppressed Droplet Splashing on Positively Skewed Surfaces for High‐Efficiency Evaporation Cooling
16天前
已完结
Effect of the Surface Peak–Valley Features on Droplet Impact Dynamics under Leidenfrost Temperature
16天前
已完结
Achieving wide temperature range of gentle film boiling on textured hydrophobic tool surfaces
16天前
已完结
Metallic θ-phase tantalum nitride has a thermal conductivity triple that of copper
2个月前
已完结
Cooling next-generation electronics: From emerging semiconductors to data centers
2个月前
已完结
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