Lv1
20 积分 2024-12-26 加入
Layered boron nitride as a release layer for mechanical transfer of GaN-based devices
28天前
已完结
Air-sinterable copper pastes for next-generation electronics: a review
6个月前
已完结
Hybrid copper–silver nanoparticle inks and their performance under thermal and photonic sintering
6个月前
已完结
Synthesis of Spherical Copper Powders by Reduction Process
6个月前
已完结
Ultrafine spherical copper powder with a narrow particle size distribution synthesized via sodium tripolyphosphate
6个月前
已完结
A novel and sensitive microneedle array platform for visual detection of glucose based on Zr-MOF@Pt nanozyme with peroxidase-like activity
9个月前
已完结
Pressureless sinter-joining of copper pastes below 200 °C via multi-solvent collaborative engineering
10个月前
已完结
Atomized droplet reaction for preparing fine silver nanoparticles with enhanced interfacial bonding and thermal conductance
10个月前
已完结
End-of-life solar panels recycling: Focusing on the kinetic and thermodynamic compensation effects during back sheets pyrolysis
11个月前
已完结
Techno-economic and environmental assessment of closed-loop photovoltaic recycling in China
11个月前
已完结
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