Lv3
364 积分 2023-03-10 加入
Tuning the rheology of copper pastes with reliable printability and enhanced storage stability
15天前
已完结
Development of high-performance Cu nanoparticle paste and low-temperature sintering for Cu–Cu bonding
2个月前
已完结
Exploration of organic matrixes in conductive silver paste: a comprehe
8个月前
已完结
The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement
8个月前
已完结
Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding
8个月前
已完结
Self-reducing copper paste with high conductivity and oxidation resistance for flexible substrate by intensive pulsed light sintering
8个月前
已完结
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