Lv3
372 积分 2023-03-10 加入
Novel copper aggregates with "Gear Chimerism" structures: High electrical conductivity, oxidation resistance, and long-term stability
9小时前
待确认
Study on the preparation of ascorbic acid reduced ultrafine copper powders in the presence of different protectants and the properties of copper powders based on methionine protection
11小时前
已完结
Ultrafine spherical copper powder with a narrow particle size distribution synthesized via sodium tripolyphosphate
12小时前
已完结
Tuning the rheology of copper pastes with reliable printability and enhanced storage stability
4个月前
已完结
Development of high-performance Cu nanoparticle paste and low-temperature sintering for Cu–Cu bonding
6个月前
已完结
Exploration of organic matrixes in conductive silver paste: a comprehe
1年前
已完结
The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement
1年前
已完结
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