Lv4
420 积分 2025-04-16 加入
Integration of Through-Dielectric-Via on Buried Power Rail and Slit Nano Through-Silicon-Via for Enhanced Backside Connectivity
23天前
已完结
Pure-Metal Replacement Gate for Reliable 30 nm Pitch Scaled 3D NAND Flash
23天前
已完结
Selective and Superconformal Molybdenum Growth Strategies for Advanced Metallization
23天前
已完结
ALD Mo for Advanced MOL Local Interconnects
23天前
已完结
Selective ALD Mo Deposition in 10nm Contacts
23天前
已完结
Halogen Free Low Temperature ALD Mo-based Films for Interconnects Applications
30天前
已完结
Enhanced Performance of P-FeFETs with TiN:2.5nm/Mo/TiN Gate Stacks for 3-Bit-Per-Cell Operation, 3.5V Read-After-Write, and High Endurance (109 Cycles) in Compute-in-Memory Applications
30天前
已完结
Mechanistic and Performance Aspects for Co-designed Process Technology to Enable Mo as the Next Generation Conductor
30天前
已完结
Recent trends in thermal atomic layer deposition chemistry
2个月前
已完结
DRAM-Peri FinFET - A Thermally-Stable High-Performance Advanced CMOS RMG Platform with Mo-Based pWFM for sub-10nm DRAM
3个月前
已完结
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