Lv31
210 积分 2024-08-15 加入
Study of damage mechanism on single crystal 4H-SiC surface layer by picosecond laser modification (PLM)
1个月前
已完结
Surface micromorphology and nanostructures evolution in hybrid laser processes of slicing and polishing single crystal 4H-SiC
2个月前
已完结
Slicing of 4H‐SiC Wafers Combining Ultrafast Laser Irradiation and Bandgap‐Selective Photo‐Electrochemical Exfoliation
3个月前
已完结
Investigation on the Processing Quality of Nanosecond Laser Stealth Dicing for 4H-SiC Wafer
3个月前
已完结
Influence of crystal orientation and incident plane on n-type 4H-SiC wafer slicing by using picosecond laser
3个月前
已完结
Internal modified structure of silicon carbide prepared by ultrafast laser for wafer slicing
8个月前
已完结
New laser slicing technology named KABRA process enables high speed and high efficiency SiC slicing
8个月前
已完结
Suppression of backside damage in nanosecond internal-focusing pulse laser dicing with wavefront modulation
8个月前
已完结
Internal Modification of Ultra Thin Silicon Wafer by Permeable Pulse Laser
8个月前
已关闭
Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes
8个月前
已完结
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