Lv3
228 积分 2024-08-15 加入
Additional laser processing for reliable laser diamond slicing along the {100} plane
24天前
已关闭
Additional laser processing for reliable laser diamond slicing along the {100} plane
27天前
已完结
Comprehensive holographic parallel beam modulation inside material based on automatic differentiation
3个月前
已完结
Laser-assisted grinding of silicon nitride by picosecond laser
8个月前
已完结
Investigation on ultrasonic vibration-assisted femtosecond laser polishing of C/SiC composites
8个月前
已完结
Morphology evolution mechanisms and localized structural modification of repaired sites on fused silica optics processed by CO2 laser rapid ablation mitigation
8个月前
已完结
Rotary laser thinning of silicon wafer via diffractive optical element: Effects of process parameters on surface integrity
8个月前
已完结
Rotary laser thinning of silicon wafer via diffractive optical element: Effects of process parameters on surface integrity
9个月前
已完结
皖公网安备34019202002308
