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250 积分 2024-08-15 加入
Rotary laser thinning of silicon wafer via diffractive optical element: Effects of process parameters on surface integrity
14天前
已完结
Numerical and experimental analysis of nanosecond laser ablation of SiC
6个月前
已完结
Ablation threshold measurements and surface modifications of 193 nm laser irradiated 4H-SiC
6个月前
已完结
Simulation study of laser ablation of C/SiC composites
6个月前
已完结
Study of damage mechanism on single crystal 4H-SiC surface layer by picosecond laser modification (PLM)
7个月前
已完结
Surface micromorphology and nanostructures evolution in hybrid laser processes of slicing and polishing single crystal 4H-SiC
8个月前
已完结
Slicing of 4H‐SiC Wafers Combining Ultrafast Laser Irradiation and Bandgap‐Selective Photo‐Electrochemical Exfoliation
10个月前
已完结
Investigation on the Processing Quality of Nanosecond Laser Stealth Dicing for 4H-SiC Wafer
10个月前
已完结
Influence of crystal orientation and incident plane on n-type 4H-SiC wafer slicing by using picosecond laser
10个月前
已完结
Internal modified structure of silicon carbide prepared by ultrafast laser for wafer slicing
1年前
已完结
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