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Analysis of temperature distribution in the chip-on-glass bonding process
7小时前
待确认
Mechanical analysis of Ultra-Thin-Chip-on-Flex (UTCOF) with anisotropic conductive adhesive (ACA) joints
2天前
已完结
84‐4: Transfer of Flip‐Chip Structure micro‐LED from Sapphire to Thin Film
2个月前
已完结
A Facile Multi‐transfer Method by Flexible Tape for Micro‐LED Display Applications
2个月前
已完结
Flexible GaN LED on a polyimide substrate for display applications
2个月前
已完结
Printed Assemblies of Inorganic Light-Emitting Diodes for Deformable and Semitransparent Displays
2个月前
已完结
Growth, transfer printing and colour conversion techniques towards full-colour micro-LED display
2个月前
已完结
Array of GaN Micro-LED Chips and Monocrystal Si CMOS Pixel Circuit Chips Mounted on Flexible Substrate
2个月前
已关闭
GaN-based micro-LED arrays on flexible substrates for optical cochlear implants
2个月前
已完结
High‐Efficiency, Microscale GaN Light‐Emitting Diodes and Their Thermal Properties on Unusual Substrates
3个月前
已完结
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